CARMODES

We utilize high-precision Press, Rotary, Thomson, and Laser cutting systems to perform advanced die-cutting, lamination, and precision punching. Depending on the material thickness, shape, and dimensional requirements, we select the optimal processing method to maximize productivity and quality, even for complex multilayer components.

We operate a dedicated sampling process for New Product Introduction (NPI). Prototype samples are quickly produced using laser processing or sample dies before mass-production tooling is completed. Once specifications are finalized, production seamlessly transitions to mass manufacturing, supporting everything from low-volume orders to full-scale production.

In addition to industrial tapes and foam materials, we specialize in processing high-performance materials compliant with RoHS, REACH, and Halogen-Free standards. Our capabilities include EMI shielding gaskets, conductive tapes, thermal interface materials (TIM), electroplated shielding materials, and high-temperature materials for SMT applications.

We recommend 2D CAD (.DWG, .DXF) and 3D CAD (STEP, IGES) data. Even if your drawings are incomplete, our engineering team provides comprehensive technical support including material selection, reverse engineering, and Design for Manufacturability (DFM) review.

Our quality management system is based on ISO 9001 and IATF 16949 standards. Precision rotary processing enables strict CTQ control, while vision inspection systems and advanced measuring equipment verify dimensions and product quality before shipment.

After raw materials are prepared, tooling fabrication and initial sample submission (ISIR/PPAP) generally require 3–7 business days. Following customer approval, mass production typically begins within 1–2 weeks, with expedited schedules available for urgent projects.

Yes. We provide customized packaging optimized for customers' production processes, including sheet formats, Roll-to-Roll packaging, reel packaging, and carrier tape packaging compatible with SMT Pick & Place systems and automated labeling equipment.

We offer advanced converting solutions such as kiss-cutting, finger tabs, and deadening processes that significantly improve handling, reduce assembly time, and increase operator productivity.

Precision die-cutting for displays, semiconductors, and automotive electronics is performed in dedicated cleanroom environments. Strict contamination control procedures—including gowning, air showers, and vision inspection—ensure outstanding product cleanliness.

Unit pricing is transparently calculated based on material consumption, nesting efficiency, processing time, and secondary operations. We also provide complete documentation and lifecycle management for tooling investments, allowing customers to efficiently manage project costs and production assets.